Copper foil is a thin, continuous metal foil deposited on the base layer of a circuit board, It is easy to adhere to the insulation layer, to accept the protective layer of printing, 

corrosion after the formation of circuit patterns. As an important material to made of CCL and printed circuit board (PCB).

PCB copper foil (purity of more than 99.7%, thickness 5um-105um) is one of the basic materials of the electronics industry 
Chemical composition 
CU+AG (%）：：≥99.95
SN (%）：≤0.002
ZN (%）：≤0.005
PB (%）：≤0.005
NI (%）：≤0.005
FE (%）：≤0.005
SB (%）：≤0.002
S (%）：≤0.005
AS (%）：≤0.002
 BI (%）：≤0.001
O (%）：≤0.06
Other(%）：≤0.1（impurities）
Customized Dimension of Copper foil
Thickness : 9um –100um
Width : 10mm--1000mm